TIA debuts pioneering event dedicated to broadband-enabled technology innovation, high-level networking, education and business growth - to be held June 7-9, 2011 in Silicon Valley.
Arlington, Va. – The Telecommunications Industry Association (TIA) – the leader in advocacy, standards development, business development and intelligence for the information and communications technology (ICT) industry – announced today the launch of a new, distinctive event experience to satisfy industry demand.
The event, to be held June 7-9, 2011 in California’s Silicon Valley, will promote broadband-enabled technology innovation, networking, education, and business growth at a time when the industry is forecast to emerge from the grips of the global economic recession. TIA is developing a fully integrated marketing and meeting platform, combining a unique live event with a state-of-the-art online show.
“TIA is offering the first industry-leading event with a combined physical and virtual presence,” said TIA President Grant Seiffert. “With input from our member companies, we will produce a non-traditional, forward-looking conference and showcase, including an integrated online exhibition that adapts to technology advances and global economic shifts, as well as to the changing needs and buying trends of the ICT industry.
As the trade association representing the entire industry – broadband, mobile/wireless, information technology, networks, cable, fiber, as well as smart apps, smart devices and Smart Grid technology – TIA is uniquely positioned to address real, day-to-day ICT concerns.”
Seiffert added that the show will integrate aspects of the important work of TIA members in developing engineering standards, policy initiatives, market intelligence, and the environment.
With more than 25 years of experience in producing B2B events, TIA will mobilize resources and the ICT community to develop an event that builds a platform for the industry’s future – rich in content and broad in scope - focused on innovation and the critical challenges facing the ICT industry.
“With buyers and sellers approaching the marketplace differently, TIA has polled ICT industry CEOs, analysts, vendors and purchasers to identify and respond to their evolving needs,” said Seiffert. “Cost, return on investment, channels to market, innovation and product launches are viewed in a new light, and TIA is following these trends to ensure that we control costs for exhibitors while increasing the value of business development and executive interactions.”
For more information on TIA’s June 2011 Silicon Valley event, contact Taly Walsh, VP for Sustainability, Intelligence and Networking at +1.703.907.7744 or email@example.com.
Sign up for RSS feeds on TIA news.
The Telecommunications Industry Association (TIA) represents the global information and communications technology (ICT) industry through standards development, advocacy, tradeshows, business opportunities, market intelligence and world-wide environmental regulatory analysis. Since 1924, TIA has been enhancing the business environment for broadband, mobile wireless, information technology, networks, cable, satellite and unified communications. Members’ products and services empower communications in every industry and market, including healthcare, education, security, public safety, transportation, government, the military, the environment and entertainment.
TIA is accredited by the American National Standards Institute (ANSI). Visit tiaonline.org.
TIA’s Board of Directors includes senior-level executives from ADTRAN, Alcatel-Lucent, ANDA Networks, AttivaCorp, Cisco Systems, Ericsson, Inc., GENBAND, Inc., Henkels & McCoy, ILS Technology, Intel Corporation, Intersect, Inc., LGE, Microsoft, Motorola, Nokia Siemens Networks, Openwave, Inc., Panasonic Computer Solutions Co., Powerwave Technologies, Qualcomm, Research In Motion, Sumitomo Electric Lightwave Corporation, Tellabs, Tyco Electronics, Ulticom, Inc., and Wirefree. Advisors to the Board include FAL Associates, Orca Systems and Telcordia Technologies.
please sign in to rate this article