HPE & Intel

Super Panel: Are MEC and NFV the key building blocks for 5G? - Part 1

By Martyn Warwick

Oct 23, 2017

Super Panel

Our super panelists from Deutsche Telekom, Hewlett Packard Enterprise, Intel,  Swisscom & Telefonica explore:

  • Chicken and Egg: Which comes first NFV or MEC?
  • Does MEC even need NFV?
  • Do the new use cases that MEC will purportedly enable help to justify the CSPs RoIe in NFV?
  • What are these use cases?
  • What are the challenges in creating an NFV/MEC architecture for CSPs?
  • How can they overcome them?
  • Will MEC enable CSPs to offer 5G style service

Interviewer/Moderator:

Martyn Warwick
Editor in Chief 
TelecomTV

Featuring:

Caroline Chan
Vice President, Data Center Group, & General Manager, 5G Infrastructure Division,
Intel Corporation
 
Diego R. Lopez
Head of Technology Exploration & Standards, Telefónica
Telefonica I+D
 
Marcus Brunner

Head of Standardisation
Swisscom

Axel Clauberg
Vice President, Aggregation, Transport, IP (TI-ATI) & Infrastructure Cloud Architecture 
Deutsche Telekom AG

Vinay Saxena
HPE Fellow
NFV Architect, Communications Solutions Business
Hewlett Packard Enterprise

Filmed at: The Louwman Museum, The Hague, Netherlands

Email Newsletters

Sign up to receive TelecomTV's top news and videos, plus exclusive subscriber-only content direct to your inbox.

Subscribe

Cookies

TelecomTV uses cookies and third-party tools to provide functionality, personalise your visit, monitor and improve our content, and show relevant adverts.