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Super Panel
Our super panelists from Deutsche Telekom, Hewlett Packard Enterprise, Intel, Swisscom & Telefonica explore:
- Chicken and Egg: Which comes first NFV or MEC?
- Does MEC even need NFV?
- Do the new use cases that MEC will purportedly enable help to justify the CSPs RoIe in NFV?
- What are these use cases?
- What are the challenges in creating an NFV/MEC architecture for CSPs?
- How can they overcome them?
- Will MEC enable CSPs to offer 5G style service
Interviewer/Moderator:
Martyn Warwick
Editor in Chief
TelecomTV
Featuring:
Caroline Chan
Vice President, Data Center Group, & General Manager, 5G Infrastructure Division,
Intel Corporation
Diego R. Lopez
Head of Technology Exploration & Standards, Telefónica
Telefonica I+D
Marcus Brunner
Head of Standardisation
Swisscom
Axel Clauberg
Vice President, Aggregation, Transport, IP (TI-ATI) & Infrastructure Cloud Architecture
Deutsche Telekom AG
Vinay Saxena
HPE Fellow
NFV Architect, Communications Solutions Business
Hewlett Packard Enterprise
Filmed at: The Louwman Museum, The Hague, Netherlands
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